The demands placed on today’s electronics can seem simply overwhelming. Consumers want devices to be smaller and faster. Engineers are requiring more flexibility, power, and durability from components within those devices. Protecting these delicate components demands innovative adhesives and coatings.
Novagard’s electronics grade silicones combine increased flexibility and high temperature resistance, allowing you more versatility in the design and assembly process. Our silicones reliably seal, bond, coat, gasket, and encapsulate to protect sensitive components and modules, increase the reliability, and extend the useful life of your product.
Why use alkoxy silicones in electronics?
- Flexible and durable
- Environmental, UV, and chemical resistant
- Excellent physical properties
- Superior dielectric performance
- Primerless adhesion
- Thermal stability
- Preferred solution for shock absorption and vibration damping
- Easy to dispense
UV Cure and UV/Dual Cure Silicones
800-505FCLF is a UV-curable, silicone conformal coating, pottant, or sealant with a secondary, neutral alkoxy moisture cure for enhanced adhesion and shadow cure. This material is specially formulated with a high-hardness, low-energy surface after curing, resulting in a low friction surface that resists dust and dirt pickup in outdoor applications.
800-750TFC is also formulated with a high thixotropic ratio to maintain shape and predictable consistency during dispensing. The UV primary cure reacts in seconds, while the addition of our Fast Cure technology allows the secondary, neutral alkoxy moisture cure to begin within 30 minutes for enhanced adhesion and a complete cure, even in shadow areas.
800-506FC features a UV primary cure and a secondary moisture cure. 800-506FC’s extremely low viscosity allows it to flow easily into even the most complex geometries. 800-506FC will UV-cure to a depth of 5mm in a single pass.
800-751TFC features an uncured viscosity of 35,000 cPs, providing greater control and precision during dispense. UV primary cure and secondary moisture cure. 800-751TFC will UV-cure to a depth of 5mm in a single pass.
800-754 is a UV-cure only pottant that cures to a soft, compliant elastomer that relieves stress and strain on delicate components. 800-754 will UV-cure to a depth of 14mm in a single pass.
800-755 is an incredibly soft non-corrosive, single-component gel and is an ideal pottant or encapsulant that will also dramatically increase your throughput.
800-245 is a UV-cured conformal coating. Its moderately flowable viscosity easily coats complex geometries. Fully cured with UV light only (no secondary cure), this silicone offers moderate hardness with good electrical properties.
800-620 is a very soft, clear, encapsulant/gel, designed to maximize vibration damping. It is a low strength silicone with limited adhesion which reduces strain on delicate components. UV only cure.
800-255 is a first-generation pin connector sealant. Its oxime secondary moisture cure provides improved physical properties. The oxime moisture cure can present potential corrosion issues in enclosed applications.
800-260 is a first-generation conformal coating for printed circuit boards. While its oxime secondary moisture cure provides improved physical properties, it offers limited adhesion and can present potential corrosion issues in enclosed applications. This silicone is rated UL 746 E, V-1.
With viscosity of 50,000 cPs, 800-750 clings readily to components for staking and glob-top applications. This non-corrosive, single component silicone will cure to an extremely soft elastomer in seconds upon exposure to UV light, making it ideal for stress and strain relief as well as protection of delicate circuits. It has a secondary, neutral alkoxy moisture cure for enhanced adhesion and shadow cure.
800-230 offers design engineers a higher viscosity coating option, while still remaining flowable. 800-230 is an ideal staking material for securing small components against vibration. It is a UV only cure, providing limited adhesion.
800-235 is UV-cured, semi-flowable material. A UV-cure only silicone with limited adhesion, its higher viscosity makes it ideal for cured-in-place gaskets.
800-240 is a UV-cure only, semi flowable material similar to 800-235. 800-240 offers higher hardness and abrasion resistance with good elongation and electrical properties.
800-400 is a UV-only, fast-curing paste without adhesion. With nominal viscosity of 360,000 cPs, 800-400 consistently holds its shape even when dispensed into complex shapes.
800-610 is a low viscosity, pourable encapsulant. Its extremely low viscosity ensures the material flows easily around components for thorough wet-out. This is a UV cure with no secondary moisture cure, offering very low adhesion.
800-520FC is a UV-curable, silicone conformal coating, pottant, or sealant. This version of our original 800-520 coating utilizes Fast Cure technology to begin moisture cure of shadow areas in as little as 30 minutes, and provides a harder, more durable surface than our standard 800-520.
800-505FC is a UV-curable, silicone conformal coating, pottant, or sealant. It has a secondary, neutral alkoxy moisture cure for enhanced adhesion and shadow cure. Utilizing our Fast Cure technology, this secondary moisture cure begins in as little as 30 minutes and can develop full adhesion in hours.
Electronics Grade (Alkoxy) Silicones
500-210 is a balanced-performance silicone coating featuring a room temperature alkoxy moisture cure that can be accelerated with heat. Soft enough to reduce strain on components while being tough enough to resist abrasion.
500-224 is an is an opaque, single-component silicone coating and encapsulating compound that cures at room temperature to form an extremely tough, strong, abrasion-resistant coating that completely hides your circuitry and components.
500-211 is a compliant, optically clear coating.
500-222 is a tough, optically clear conformal coating and encapsulant that remains flexible and non-brittle.
500-223 cures to an extremely soft, optically clear gel to provide maximum stress and strain relief in addition to great dielectric properties.
500-228 cures to a tough, strong, resilient gel to provide protection from both physical damage and mechanical stress and strain relief in addition to great dielectric properties.
500-090, 500-091, and 500-092 are a family of UL-rated electronics adhesives. These one-part UL flame rated pastes are for applications that require superior bond strength and flame resistance.
500-607 is a soft, very low viscosity clear pottant that flows easily into intricate architectures and complex designs, with low shrinkage and long working times.
Addition Cure Silicones
600-160 is a two-component, addition-cure silicone that, when mixed, cures to a flexible elastomer.
600-170 is a two-component, addition-cure silicone that, when mixed, cures to a flexible elastomer.
600-180 is a two-component, addition-cure silicone that, when mixed, cures to a flexible elastomer, formulated with moderate elongation and exceptional tensile strength.
High Temperature Foams
60-HTA is a soft, high temperature closed cell foam designed for applications requiring a low force to compress, and for filling large voids and variable gaps.
100-HTA is a high temperature closed cell foam designed for applications requiring both flexibility and strength, and balances compressibility with increase strength and wear resistance.
150-HTA is a high temperature closed cell foam designed for applications requiring a cushion against heavy loads, and withstands wear and abrasion in “tough duty” applications.
Thermally Conductive Compounds
G641 offers excellent heat transfer in large and small electrical and electronic components and is an ideal material for use in thermocouple wells, power diodes, transistors, semiconductors, and ballasts. G641, or G644 can be used as direct alternatives to Dow Corning / DuPont Molykote DC340.
Versilube G644 is a softer, lower viscosity version of the original Novagard thermal compound, G641. Both G644 and G641 can be used as direct alternatives to Dow Corning / DuPont Molykote DC340.