The demands placed on today’s electronics can seem simply overwhelming. Consumers want devices to be smaller and faster. Engineers are requiring more flexibility, power, and durability from components within those devices. Protecting these delicate components demands innovative adhesives and coatings.
Novagard’s electronics grade silicones combine increased flexibility and high temperature resistance, allowing you more versatility in the design and assembly process. Our silicones reliably seal, bond, coat, gasket, and encapsulate to protect sensitive components and modules, increase the reliability, and extend the useful life of your product.
Why use alkoxy silicones in electronics?
- Flexible and durable
- Environmental, UV, and chemical resistant
- Excellent physical properties
- Superior dielectric performance
- Primerless adhesion
- Thermal stability
- Preferred solution for shock absorption and vibration damping
- Easy to dispense
UV Cure and UV/Dual Cure Silicones
800-750TFC is formulated with a high thixotropic ratio so it will hold its shape more readily when dispensed than our standard 800-750.
800-506FC features a UV primary cure and a secondary moisture cure. 800-506FC’s extremely low viscosity allows it to flow easily into even the most complex geometries. 800-506FC will UV-cure to a depth of 5mm in a single pass.
800-751TFC features an uncured viscosity of 35,000 cPs, providing greater control and precision during dispense. UV primary cure and secondary moisture cure. 800-751TFC will UV-cure to a depth of 5mm in a single pass.
800-754 is a UV-cure only pottant that cures to a soft, compliant elastomer that relieves stress and strain on delicate components. 800-754 will UV-cure to a depth of 14mm in a single pass.
800-755 is an incredibly soft non-corrosive, single-component gel and is an ideal pottant or encapsulant that will also dramatically increase your throughput.
800-245 is a UV-cured conformal coating. Its moderately flowable viscosity easily coats complex geometries. Fully cured with UV light only (no secondary cure), this silicone offers moderate hardness with good electrical properties.
800-620 is a very soft, clear, encapsulant/gel, designed to maximize vibration damping. It is a low strength silicone with limited adhesion which reduces strain on delicate components. UV only cure.
800-255 is a first-generation pin connector sealant. Its oxime secondary moisture cure provides improved physical properties. The oxime moisture cure can present potential corrosion issues in enclosed applications.
800-260 is a first-generation conformal coating for printed circuit boards. While its oxime secondary moisture cure provides improved physical properties, it offers limited adhesion and can present potential corrosion issues in enclosed applications. This silicone is rated UL 746 E and V-1.
With viscosity of 45,000 ― 60,000 cPs, 800-750 clings readily to components for staking and glob-top applications.
800-230 is a UV curable self-leveling silicone pottant that offers a higher viscosity coating option, while still remaining flowable.
800-235 is UV-cured, semi-flowable material. A UV-cure only silicone with limited adhesion, its higher viscosity makes it ideal for cured-in-place gaskets.
800-240 is a UV-cure only, semi flowable material similar to 800-235. 800-240 offers higher hardness and abrasion resistance with good elongation and electrical properties.
800-400 is a UV-only, fast-curing paste without adhesion. With nominal viscosity of 200,000 – 400,000 cPs 800-400 consistently holds its shape even when dispensed into complex shapes.
800-610 is a low viscosity, pourable or sprayable encapsulant. Its low viscosity ensures the material flows easily around components for thorough wet-out. This is a UV cure with no secondary moisture cure, offering very low adhesion.
800-520FC is a UV-curable, silicone conformal coating, pottant, or sealant. 800-520FC will cure to a solid elastomer in seconds upon exposure to ultraviolet (UV) light.
800-550 is a UV-curable, silicone coating, pottant, or sealant. With a viscosity of 5,000 ― 6,500 cPs, 800-550 flows readily to surround the complex geometry of modern circuitry design.
800-505FC is a UV-curable, silicone conformal coating with a secondary, neutral alkoxy moisture cure for enhanced adhesion and shadow cure. It is UL 746E certified with a V-1 rating for flammability. Utilizing our Fast Cure technology, this secondary moisture cure begins immediately and develops full adhesion in hours.
Electronics Grade (Alkoxy) Silicones
500-210 is a balanced-performance clear sprayable silicone coating featuring a room temperature alkoxy moisture cure that can be accelerated with heat. This silicone is UL 746E certified and has a V-1 rating for flammability.
500-224 is an is an opaque, single-component silicone coating and encapsulating compound that cures at room temperature to form an extremely tough, strong, abrasion-resistant coating that completely hides your circuitry and components.
500-211 is a compliant, optically clear coating.
500-228 cures to a tough, strong, resilient gel to provide protection from both physical damage and mechanical stress and strain relief in addition to great dielectric properties.
500-09x is a high performance UL-rated electronics adhesive. This one-part UL flame rated paste is for applications that require superior bond strength and flame resistance.
500-150 is a single-component translucent alkoxy paste that has a good balance of tensile strength and elongation.
High Temperature Foams
60-HTA is a soft, high temperature closed cell foam designed for applications requiring a low force to compress, and for filling large voids and variable gaps.
100-HTA is a high temperature closed cell foam designed for applications requiring both flexibility and strength, and balances compressibility with increase strength and wear resistance.
150-HTA is a high temperature closed cell foam designed for applications requiring a cushion against heavy loads, and withstands wear and abrasion in “tough duty” applications.
Thermally Conductive Compounds
G641 offers excellent heat transfer in large and small electrical and electronic components and is an ideal material for use in thermocouple wells, power diodes, transistors, semiconductors, and ballasts. G641, or G644 can be used as direct alternatives to Dow Corning / DuPont Molykote DC340.
Versilube G644 is a softer, lower viscosity version of the original Novagard thermal compound, G641. Both G644 and G641 can be used as direct alternatives to Dow Corning / DuPont Molykote DC340.