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Electrical Potting and Encapsulation Silicones

For some production environments and below ground applications, the right compound for potting and encapsulation may be an addition cure gel system.

These solvent-free, two-component systems cure to flexible elastomers with no corrosive by-products. All are electronics grade, have exceptionally fast cure rates, and offer convenient mix ratios along with excellent dielectric properties.

Applications:

  • Junction box enclosures
  • Cable splice kits
  • Waterproof connectors
  • Sensors
  • Electrical insulation
  • Amplifiers & relays
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