Addition Cure Silicones

Electrical Potting and Encapsulation Silicones

For some production environments and below ground applications, the right compound for potting and encapsulation may be an addition cure gel system.

These solvent-free, two-component systems cure to flexible elastomers with no corrosive by-products. All are electronics grade, have exceptionally fast cure rates, and offer convenient mix ratios along with excellent dielectric properties.